DM-8510 – New high precision Scriber/Breaker for III-V wafers, ceramic substrates and comparable brittle materials
The high precision Scriber/Breaker is the first product of a new family of separation systems which has been primarily designed for III-V materials. III-V wafers and ceramic substrates are very brittle and difficult to separate into individual chips/dies. The new semi-automated system offers a wider range of parameters for the separation process, as well as higher stage accuracy and repeatability.
The standard semi-automated diamond Scribe/Break system DM-8510 can separate wafers up to 150 mm diameter, which covers 100% of todays III-V wafer production. Passive temperature compensation enhances the repeatability of the complete scribe and break process.
The main features of the DM-8510 system are:
- Encoder controlled air bearing stage for accurate and repetitive positioning
- Force feedback controlled scribe module to apply even scribe force across the wafer independent of any wafer warpage
- Individual adjustable break backer to optimize the break process
- High process flexibility and repeatability
- Wide range of process parameters to cover multiple applications/materials
- High productivity due to semi-automated operation
- High resolution imaging system enhances positional accuracy and repeatability.
High precision components
- stable, shock absorbing granite stage
- low maintenance XYT air bearings
- all major axis are linear encoder controlled
Superior process performance
- scribe speed up to 250mm/sec
- scribe module with force feedback control (patent applied)
- break cycle programmable from 0.02 - 2 sec
- low break force due to independent, free progammable anvils (patent applied)
- variable cutter knife angle for optimised edge cutting
- 1 micron XY position repeatability
Capabilities
- Continuous scribe
- Skip scribe
- Edge scribe
- Break with free programmable anvil positioning
- Edge break with variable cutter knife angle
Materials
- III-V Substrates
- compound wafers and strips (GaAs, SiGe, GaN, InP)
- Ceramic sheets
- Silicon thin wafers
- Glass substrates
More information about DynTest is available at www.dyntest.de
If you require further information please click on the "More Information" link at the top of the page and one of our team will provide any details you may require.
Or contact us directly:
Firfax Systems Ltd
Meteor Business Park,
Gloucestershire Airport,
Cheltenham Road East,
Gloucester,
GL2 9QL, UK.
T. +44 (0) 1452 717 800
E. sales@firfaxsystems.co.uk