The
DYMATiX 1300 provides the ultimate in speed and capability for dedicated
sorting of die from a film-frame into pocket tape. The system can
process wafers up to 300mm in diameter and includes die inversion for flip
chip applications. The 1300 combines new and existing technologies to create
a unique machine optimized for performance.
The 1300 precisely places die and includes the DYMATiX signature programmable plunge-up subsystem. This dual stage plunge-up mechanism facilitates the processing of irregular die shapes and sizes of very small, as well as thin die. The 1300 further positions DYMATiX as the leader in processing the largest range of die sizes and material types, with the shortest changeover times in the industry.
Machines come equipped with robotic film-frame loading, programmable film expansion, 4-position frame rotation for proper die placement, and a robust, multifaceted vision system. Systems are ergonomically designed, provide easy service access, are CE compliant and meet the requirements of Semi S2-0200 and Semi S8.
If you require further information please click on the "More Information" link at the top of the page and one of our team will provide any details you may require.
Or contact us directly:
Firfax Systems Ltd
Meteor Business Park,
Gloucestershire Airport,
Cheltenham Road East,
Gloucester,
GL2 9QL, UK.
T. +44 (0) 1452 717 800
E. sales@firfaxsystems.co.uk