The
DYMATiX family of Demounters offers reliable, low-cost solutions for the
removal of die from sawn film frames. The machines are user-friendly and
require no mechanical adjustments, which means the operator can run all
die sizes with only a single setup.
Operation of the machines is easy. The operator places the film frame on the
unit. The Demounter then separates the die from the tape, spreading the die loosely
on a removable tray, while still maintaining the original orientation. This entire
process takes less than 30 seconds. The tray can then be taken to another area
for manual die sorting. Using several of these trays allows a number of operators
to sort die simultaneously.
The 1010D peels die as small as .070-inch square (1.75mm) from wafers up to 200mm
in diameter.
The 2010 peels die down to .020-inch square (.50mm) from wafers up to 150mm in
diameter. The 2010SD (Shown right) is equivalent to the 2010 with the added capablilty
of peeling very small die of .010 inch square (.25mm).
The DYMATiX Model 3010 Die Demounter can easily remove fully sawn wafers from
a film frame in less than thirty seconds. Die as small as .030 inch square can
be easily and quickly peeled without any damage to the die.
If you require further information please click on the "More Information" link at the top of the page and one of our team will provide any details you may require.
Or contact us directly:
Firfax Systems Ltd
Meteor Business Park,
Gloucestershire Airport,
Cheltenham Road East,
Gloucester,
GL2 9QL, UK.
T. +44 (0) 1452 717 800
E. sales@firfaxsystems.co.uk